Laser Baking: Composed of hardware such as high-power lasers, beam homogenizers, and infrared thermometers.

Die-Cutting: Composed of components including electrode unwinding, tab punching, C-corner/R-corner notching, electrode cutting, and visual defect inspection.

Z-Stacking: Composed of components including diaphragm unwinding, material-taking manipulators, electrode sheet correction platforms, lamination platforms, lamination loading manipulators, lamination unloading manipulators, and side adhesive mechanisms.